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Home > products > Semiconductor Package > SM-6700 In-line cleaning machine for packaging substrate

SM-6700 In-line cleaning machine for packaging substrate

It is suitable for flux residue cleaning before molding of high-capacity flip chip, sip, lead frame and other packaging devices. This equipment has been used in cleaning all kinds of semiconductor reliability equipment, such as fingerprint, camera module, communication, RF, power control, etc

 

SM-6700 has core technology and patents, and a variety of options to meet user optimization process and control costs.

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  • ◆It is applicable to large-scale cleaning and complete all in-line processes of chemical cleaning, pure water rinsing and drying

    ◆Meet the cleaning requirements of large size and small bottom clearance

    ◆Excellent cleaning effect, effectively remove flux, organic and inorganic pollutants

    ◆Air blade cutting water + hot air circulation, fast drying

    ◆Spray cleaning blade is selected for better cleaning effect

    ◆Provide automatic solution for loading / unloading

    ◆The stainless steel body of the whole machine meets the cleaning requirements of high temperature chemicals

    ◆The arrangement position of spray bar can be matched with the future upgrading and process requirements, so as to facilitate the subsequent more complex cleaning

    ◆The multi-channel transmission system can be customized to meet the needs of customized cleaning equipment

    ◆Indoor lighting is set inside the machine to improve the process area identification

  • Dimension

    7000(L)x1700(W)x1750(H) mm

    Cleaning product size

    Max 400(L)x600(W)x60(H) mm
    Min 50*50 mm(need fixed by jig)

    Conveyor speed

    100--1500 mm/min Adjustable

    Conveyor height

    850--950mm

    Conveyor width

    600 mm

    Water consumption

    10~15L/min(Depends on clean products)

    Direction of board

    Left to right

    Control method

    Touch screen and PLC

    Power Supply

    AC 380V 3P 50HZ 120KW 180A

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